X-EYE NF120
Nano-Focus X-RAY

Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging (WLP) requiring detection of Sub-micron defects.

Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.

Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.

Non-destructive analysis system
for Wafer Level Packaging

High resolution image
with Dual Type CTs

TSV, Micro Bump,
Pattern

TECHNICAL DATA

X-RAY TUBE

120 kV / 200µA

MIN. RESOLUTION

0,2 µm

TABLE SIZE

12 inch (305×305 mm) wafer

DETECTOR

6 inch (152 mm) FPXD

CT SCAN METHOD

Oblique CT

Cone beam CT

AXIS

X, Y, Z Tilt (70º), R

DIMENSIONS

Width: 2380 mm

Length: 1450 mm

Height: 2120 mm

WEIGHT

7000 kg

SAMPLE PHOTOS

APPLICATIONS

PKG

WAFER

APPLICATIONS

PKG

WAFER

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